Summary:
Provide Embedded Package design total solution; include but not limited to Stack up discussion . ECP module design, layout, development, timeline tracking and handle the module relevant qualification.
RESPONSIBILITIES:
- Embedded substrate or PCB layout for Module projects.
- Need work with Substrate/PCB vendor, assembly house, SMT site, material vendor, to develop and qualify the new materials and new package processes.
- Coordinate with the internal team to identify the module package related issues, giving report/suggestions for new packages, address the root cause and find the solution.
- Sum up the experience of Embedded package design, SMT and maintain the design rule.
- Review the packaging drawings and assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc;
- Tracking new module PKG timeline and response to internal team.
- Perform other tasks assigned by superiors.
REQUIREMENTS:
1. Hands-on experience on substrate design in Substrate/PCB factory.
2. Be Proficient Cadence software. AutoCAD.
3. Good knowledge of Embedded packages design rules and manufacture processes/ issues
4. Bachelor’s degree with 5 years related experience.
KEY WORDS:
Embedded Substrate layout, OrCAD
Package designer Standard, CAD, substrate manufacture experience